infrared array sensor grid-eye (amg88) ordering information types tape and reel package: 1,000 pcs. rating high precision infrared array sensor based on advanced mems technology infrared array sensor grid-eye product name number of pixel operating voltage ampli?ation factor pa rt number infrared array sensor grid-eye 64 (vertical 8 horizontal 8 matrix) 3.3 v dc high gain amg8831 low gain amg8832 5.0 v dc high gain amg8851 low gain AMG8852 item standard high gain low gain applied voltage 3.3v 0.3v or 5.0v 0.5v temperature range of measuring object 0 c to 80 c +32f to +176 f ?0c to 100 c ?f to +212 f operating temperature range 0 c to 80 c +32f to +176 f ?0 c to 80 c ? f to +176 f storage temperature range ?0 c to 80 c ?f to +176 f ?0c to 80 c ? f to +176 f features 1. temperature detection achieved on a two dimensional area with 8 8 (64) pixels. 2. digital output (temperature values can be output) 3. miniature smd package (re?w mounting supported) typical applications ?high performance home appliance (microwave oven and air conditioner) ?energy savings in of?e (air- conditioning and lighting controls) ?digital signage ?automatic door and elevator new vertical pixel 8: 8 pixels applied voltage 3: 3.3 v dc 5: 5 v dc amg 8 8 horizontal pixel 8: 8 pixels amplification factor 1: high gain 2: low gain asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e rohs compliant
infrared array sensor grid-eye (amg88) absolute maximum ratings characteristics note: *1. to have more than 4 c 7.2 f of temperature difference from background detection object size: 700 250 mm 27.559 9.843 inch (assumable human body size) functions internal circuit * int terminal 4 normally has same voltage as vdd. when interrupting, same as gnd (0v). item standard te r minal applied voltage ?.3 to 6.5v vdd input voltage ?.3 to vdd + 0.3v scl, sda, ad_select output sink current ?0 to 10ma int, sda static electricity (human body model) 1kv all terminals static electricity (machine model) 200v all terminals item standard high gain low gain temperature accuracy typical 2.5c 4.5f typical 3.0c 5.4f detection distance*1 max. 5m 16.404ft viewing angle typical 60 optical axis gap within typical 5.6 current consumption typical 4.5ma (normal mode) typical 0.2ma (sleep mode) typical 0.8ma (stand-by mode) setup time typical 50ms (time to enable communication after setup) typical 15s (time to stabilize output after setup) item value number of pixel 64 (vertical 8 horizontal 8 matrix) external interface i 2 c (fast mode) fr ame rate typical 10 frames/sec or 1 frame/sec operating mode normal sleep stand-by (10 sec or 60 sec intermittence) output mode temperature output calculate mode no moving average or twice moving average temperature output resolution 0.25 c number of sensor address 2 (i 2 c slave address) thermistor output temperature range ?0 c to 80 c ?f to +176 f thermistor output resolution 0.0625 c infrared array sensor 3.3v dc or 5v dc selector thermistor gain amp adc control rom sda scl ad_select int i 2 c i/f sensor chip vdd capacitor 10f gnd gnd 9 6 2 3 5 4 asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
infrared array sensor grid-eye (amg88) pixel array and viewing field optical properties dimensions (mm inch ) 1. pixel array pixel array from 1 to 64 is shown below. 2. viewing ?ld sensor viewing ?ld (typical) is shown below. 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 87654321 horizontal viewing angle 60 ver tical viewing angle 60 1. each pixel s viewing central angle sensor s optical center (the origin of graph below) gap: within 5.6 (typical) (both of horizontal and vertical directions) 2. each pixel s viewing angle (half angle) central 4 pixels (pixel no. 28, 29, 36, 37) viewing angle (half angle): horizontal direction 7.5 (typical) ver tical direction 8 (typical) horizontal viewing central angle, ( ) ver tical viewing central angle, ( ) each pixel s horizontall viewing angle ( ) each pixel s vertical viewing angle ( ) pixel number pixel number 61 61 57 57 53 53 49 49 45 45 41 41 37 37 33 33 29 29 25 25 21 21 17 17 13 13 99 55 11 20 15 10 5 0 20 15 10 5 0 external dimensions p 51 w qu qu i wi lot no. lens 2.6 .102 2.0 .079 8.0 .315 11.6 .457 8.9 .350 14-0.5 14-.020 13-2.0 p1.27 4 p.050 4 10.9 .429 13-.079 7.8 .307 4.3 .169 1.5 .059 3.0 .118 part no. (printed without ?mg88? 5.3 .209 tolerance outside of that indicated: 0.2 .008 note: leave terminal ?c (no. q , u , i , { and w ) unconnected. make electrical potential of terminals o and q the same. te r minal layout q nc i nc w sda o vdd e scl p avdd-pc r int { nc t ad_select } dvdd-pc y gnd q vpp u nc w nc recommended pc board pad *four corners 4-0.8 4-.031 10-0.7 10-.028 p1.27 0.05 4=5.08 p.050 .002 4=.200 8.7 .343 3.5 .138 3.6 .142 (0.75) (.030) 11.0 0.05 .433 .002 cad data asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e the cad data of the products with a cad data mark can be downloaded from: http://industrial.panasonic.com/ac/e
infrared array sensor grid-eye (amg88) recommended external circuit pa cking format (tape and reel) (mm inch) notes 1. in case of setting i 2 c slave address of the sensor 1101000 * connect terminal t (ad_select) to gnd. 2. in case of setting i 2 c slave address of the sensor 1101001 * connect terminal t (ad_select) to vdd. w sda qvpp } dvdd-pc p avdd-pc ovdd escl rint t ad_select ygnd gnd vdd 10k? 10k? 10k? 10f 1.5f 1f 20? to microcomputer etc. to microcomputer etc. to microcomputer etc. gnd vdd 10k? 10k? 10k? 10k? w sda qvpp } dvdd-pc p avdd-pc ovdd escl rint t ad_select ygnd 10f 1.5f 1f 20? to microcomputer etc. to microcomputer etc. to microcomputer etc. recommended external circuit this circuit is an example to drive infrared array sensor ?rid-eye? so that we will not take any responsibility of loss which is due to this circuit. tape dimensions dimensions of tape reel 16.0 0.3 .630 .012 1.75 0.1 1.5 dia. .069 .004 4.0 0.1 .157 .004 7.5 0.1 .295 .004 2.0 0.1 .079 .004 9.0 0.1 .354 .004 4.7 0.1 .185 .004 16.0 0.1 .630 .004 12.6 0.1 .496 .004 0.35 0.05 .014 0.05 +0.1 ?0 .059 dia. +.004 ?0 1.5 dia. +0.1 0 .059 dia. +.004 0 direction of picking 2.0 0.5 .079 .020 21.0 0.8 top cover tape embossed carrier tape .827 0.8 21.5 3.0 .846 3.0 17.5 1.0 .689 1.0 13 0.5 dia. .512 .020 dia. 100.0 2 dia. 3.937 .079 dia. 380.0 2 dia. 14.961 .079 dia. 1. checkpoints relating to principle of operation the infrared array sensor is a thermobile- typed infrared sensor which detects quantity of infrared ray. generally, temperature accuracy will be degraded in the following situations. be sure to verify performance and reliability under actual conditions of use and make any necessary temperature corrections. ?there is a heat emitting body located close to where the sensor is mounted. ?a ?w of warm or cold air is hitting the sensor. ?the temperature of the sensor is subject to sudden changes. ?when an object made of glass, acrylic or other subject which far infrared rays have dif?ult passing through is located between the sensor and what is to be detected. ?a substance (dirt or water droplets) that makes it dif?ult for far infrared rays to pass through is attached to the sensor lens. 2. ambient operating conditions 1) temperature: please refer to ?ating? 2) humidity: 15% to 85% r.h. (no freezing nor condensation at low temperature) 3) atmospheric pressure: 86 to 106 kpa 4) protect the sensor from impact and vibration, because these can cause damage that leads to malfunction and degraded performance. and avoid applying a load or impact since this will deform or scratch the lens, making proper operation impossible and causing a deterioration in its performance. 5) the sensors do not have a water-proof or dust-proof construction. depending on the ambient operating conditions, some means of providing protection from water and dust and preventing the formation of ice and condensation must be provided prior to using the sensors. if condensation occurs, heat source detection response may become delayed by several seconds. 6) please avoid using or storing the infrared array sensor in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sul?es, etc.) which will adversely affect the performance of the infrared array sensor. 7) since the internal circuitry may be destroyed if an external surge voltages is supplied, provide an element which will absorb the surges. 8) malfunctioning may occur if the product is in the vicinity of electrical noise such as that from static electricity, lightning, a mobile phone, an amateur radio and a broadcasting station. asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
infrared array sensor grid-eye (amg88) 9) although the ambient temperature (humidity) range is a temperature (humidity) range which can operate a sensor continuously, the humidity range changes with temperature. so please use it in the humidity range. and please avoid continuation use near a limit. this humidity range does not guarantee durability ability. 3. other handling cautions to assure reliability, check the sensor under actual loading conditions. avoid any situation that may adversely affect its performance. 1) this sensor may malfunction if dropped on its own before it is installed. do not use if this happens. 2) caution is required because writing except for register and bit speci?d can be cause of malfunction and performance degradation. (please consult us.) 3) caution is required because differences in the temperature range and the method of connection can lead to breakdown. 4) if the sensor get high frequency vibration, it can be cause of breakdown. when the product get impulse like below, do not use it. ?touch to a object made of metal ?touch of mutual sensors 5) since static charge can damage the sensor, bear in mind the following handling precautions. ?plastic containers should not be used to store or transport the sensors since they readily become charged. ?please store or transport the sensor in an environment that hinders the occurrence of static electricity (for example, places with 45% to 60% humidity) and protect the product using electrically conductive packaging. ?implement static electricity prevention measures once the product packaging has been opened. (1) any personnel handling the sensor should wear electrostatic clothing and be body grounded. (2) place an electrically conducting board on the work surface and ground any devices used such as measuring instruments and jigs. (3) use a soldering iron with a low leak current or else ground the tip. (4) make sure that customer equipment used for device assembly is grounded. ?use a regulated power supply as the power supply. otherwise, power supply superimposed noise may cause the sensors to malfunction. 4. ambient temperature (humidity) range although the ambient temperature (humidity) range is a temperature (humidity) range which can operate a sensor continuously, the humidity range changes with temperature. so please use it in the humidity range shown below. and please avoid continuation use near a limit. generally under high temperature or high humidity, deterioration of electronic parts accelerates. to ensure reliability, please ver ify quality under conditions of actual use. ?this humidity range does not guarantee durability ability. high gain type low gain type 5. mounting use lands on the pc boards to which the sensor can be securely ?ed. recommended pc board is fr4 (thickness1.6 mm .063 inch ). as for mounting unrecommended pc board, please verify quality in advance. ?malfunctioning may occur if much noise is present in the power supply used for this sensor. in order to prevent, in particular, superimposed noise, please install the recommended capacitor between the sensor input terminals (between vdd and gnd) closest to the sensor (a position within 20 mm .787 inch of the pc pattern length). however, please reselect an ideal capacitor after performing tests on the actual equipment. ?since the top surface (where the part number is visible) of the sensor is gnd, please make sure that the metallic parts of other components do not come into contact. 6. soldering due to the thermal capacity of the infrared array sensor is low, therefore, take steps to minimize the effects of external heat. damage and changes to characteristics may occur due to heat deformation. use a non-corrosive resin type of ?x. 1) manual soldering ?set the soldering tip from 350 to 400 c 662 to 752 f (30 to 60w), and solder within 3 seconds or less. ?please note that output may be changed if the load is applied to the terminals when the soldering. ?carefully clean the tip of soldering iron. 2) re?w soldering the recommended re?w temperature pro?e conditions are given below. ?we recommend the screen solder printing method as the method of cream. ?please refer to the recommended pc board speci?ation diagram for the pc board foot pattern. ?self alignment may not always work as expected; therefore, please carefully adjust the position of the terminals and pattern. ?the temperature of the pro?e is assumed to be a value measured with the pc board of the terminal neighborhood. ?when you do the re?w solder to the back of the pc board after the re?w of the sensor, please execute ?ed processing, for instance, with the adhesive etc. 3) when you cut or fold the pc board after mounting the sensor, be careful not to stress to the soldered parts. 4) solder reworking ?finish reworking in one operation. ?for reworking of the solder bridge, use a soldering iron with a ?t tip. please do not add more ?x when reworking. ?the temperature of the soldering tip must be under the above-mentioned temperature. 5) the sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. therefore, please be careful not to touch the terminals with the metal piece or the hand. 80 0?0 +176 +32? te mperature, c f 85 15 humidity, %rh tolerance range (avoid condensation) (avoid freezing when used at temperatures lower than 0c 32f ) 80 0?0 +176 +32? te mperature, c f 85 15 humidity, %rh tolerance range (avoid condensation when used at temperatures higher than 0c 32f ) (avoid freezing when used at temperatures lower than 0c 32f ) t 1 t 2 t 3 t 1 t 2 t 1 = 150 to 180c t 2 = 230c t 3 = within 250c 302 to 356f 446f 482f t 1 = 60 to 120s t 2 = within 30s asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
infrared array sensor grid-eye (amg88) 6) to prevent the insulation of the pc board after soldering, please be careful not to place the chemicals on the sensor when coating. 7. connections 1) please perform connections correctly in accordance with the terminal connection diagram. in particular, be careful not to reverse wire the power supply as this will cause damage or degrade to the sensor. 2) please do not connect wires in an empty terminal. it causes the sensor breakdown. 3) when using the sensors with cables, it is recommended that cables which are shielded and as short as possible be used in order to safeguard against the effects of noise. 8. cleaning av oid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 9. transportation and storage 1) extreme vibration and shock during transport will damage the sensor. handle the outer box and reel with care. 2) storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. the following storage conditions are recommended. ?temperature: 0 to 45 c 32 to 113 f ?humidity: less than 70% r.h. ?atomosphere: no harmful gasses such as sulfurous acid gas, minimal dust. 3) the sensors are sensitive to moisture and come in moisture-proof packages. observe the following cautions when storing. ?after the moisture-proof package is unsealed, take the sensors out of storage as soon as possible (within 1 week 30c 86f/60% r.h.). ?if the sensors are to be left in storage for a considerable period after the moisture- proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). *when mounting with solder, if thermal stress is applied to sensors that have absorbed moisture, the moisture will vaporize, swelling will occur, and the inside of the package will become stressed. this may cause the package surface to blister or crack. therefore, please take caution and observe the soldering conditions. 10. special remarks although the best attention will be paid for the quality controls of the products, please consider the followings: 1) to prevent unexpected failures as much as possible under the conditions not shown in this speci?ations, please let us know the detailed information on the application, such as the environmental, operational and mounting condition. 2) by any chance, if the failure of the product is considered to cause a personal injury or death or property damage, the safety rate should be added to the speci?d values shown in this speci?ations and the dual safety structure or circuit is recommended to be taken from the stand point of the product liability indemnity. 3) we will either repair or replace any products or parts there of which prove to be defective against only the items written in this speci?ations within 1 year from the date of products acceptance at the site of delivery. following cases are not covered by this guarantee. ?the case of other damage caused by the failure or defect of the product. ?the case that the product condition changed by handling, storage and/or transportation after delivery. ?the case caused by the phenomenon which has never been discovered and is impossible to be foreknown with the existing technologies. ?the case of force majeure, such as acts of god, public enemy or war, ?es, ?ods and any other causes beyond the control of the people concerned. 11. export control [to customers in japan] this product is restricted under japan s ?oreign exchange and foreign trade law. an export permit from the japanese government is required when you export or take this product outside japan. (as of apr.2011) this product may not be used for any purpose other than those speci?d. reselling the product to third parties is prohibited. when disposing of the product, it must ?st be converted into non-reusable and non-controlled form. [to customers outside japan] this product is restricted under japan s laws and regulations relating to security export control (foreign exchange and f oreign trade law). we have obtained an export permit from the japanese government to sell or provide this product to your company, subject to the following: this product may not be used for any purpose other than those speci?d. this product may be subject to further export restrictions under the laws and regulations of other countries (including your own). reselling the product to third parties is prohibited. when disposing of the product, it must ?st be converted into non-reusable and non-controlled form. asctb22e 201201-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
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